Section News

IEEE Electron Devices Society Offers Sponsorships Towards Industrial Placements – Application Deadline Extended

Electron Devices Society

As a result of a second year of funding from a new initiative, opportunities are available for current and newly graduated students to spend time in industry in any of the upcoming areas of quantum technologies, neuromorphic computing/accelerators of AI, compound semiconductors (GaN and SiC),5G/IOT and renewables. These funds are meant to enable placements of undergraduate/graduate/post graduate/newly graduated students/postdocs in any company/research organization engaged in these subject areas.

The initiative is open to all, but special consideration will be given to EDS student members. The funds will pay for travel and subsistence costs for placements that are a minimum of a week in duration and completed by 1 September 2021.We also encourage virtual placements, that will support subsistence costs, such as accommodation and living expenses, of candidates who are in a transition period due to COVID-19. In such a case, the placement will be based on completion of a project lasting a minimum of a month with the company. This is the first round of applications this year with a deadline of 15 July 2021. A budget of up to $1000 USD can be allocated per person. It is expected that the funds will be disbursed equally in the Americas, Europe, and students in Africa/Asia (including Australia).

Expressions of interest from prospective candidates/departments/supervisors/companies must be submitted by email, together with a description of the candidate CV (1 page), company contact to confirm the placement, with  a paragraph about the work and duration by 31 July 2021 to m.desouza@sheffield.ac.uk.

The candidates will be shortlisted by a selection committee.  A final report consisting of a maximum of 2 A4 pages, endorsed by the training supervisor at the company, will be required, before disbursing the money at the end of the project. Applicants may make a case for a proportion of funds to be granted in advance of costs, where applicable.

A report on the successful 2020 Industry Placement Program is available here.