Electronic Packaging and Reliability Joint Chapter
Welcome to the IEEE UK and Ireland Electronic Packaging and Reliability Joint Chapter.
From mobile phones to high reliability electronic systems found in wind farms, high speed trains and aircraft, developments in the design and manufacture of electronic packages and their reliability qualification both for semiconductor and passive components has played a crucial role in ensuring that these systems meet customer expectations in terms of performance and reliability.
This joint chapter provides a forum for IEEE members of the Electronic Packaging and Reliability societies in the UK and Ireland. The chapter has been in existence for over 20 years and has over 140 members representing both academia and industry. Members receive IEEE member rates to attend workshops and conferences and access to material such as webinars provided by our societies.
New technologies such as Internet of Things (IOT), 3D-Printing (Additive Digital Manufacturing), Renewable Energy, Electric Transport, and Medical Devices to name a few, require advances and new approaches in packaging technologies, thermal management and reliability assessments. We work with similar focused institutes in organising events including workshops, conferences and presentations by IEEE distinguished lecturers in these and other technical areas related to electronic packaging and reliability.
Chapter Committee
* Subject to Excom ratification
IEEE UK and Ireland Fellow Chris Bailey Elected as Electronics Packaging Society President
IEEE UK and Ireland Fellow Chris Bailey has been elected to serve as the President of the Electronics Packaging Society for 2020-21. Chris is Professor of Computational Mechanics and Reliability at the University of Greenwich, London.
Past Chairs
