IEEE UK and Ireland Electronics Packaging and Reliability Joint Chapter Distinguished Lecture | Chiplet Design and Heterogeneous Integration Packaging
September 14 - 2:00 pm - 3:30 pm UTC+0
IEEE UK and Ireland Electronics Packaging and Reliability Joint Chapter Distinguished Lecture | Chiplet Design and Heterogeneous Integration Packaging by John H Lau, Unimicron Technology Corporation, Taiwan
Chiplet is a chip design method and heterogeneous integration is a chip packaging method which has been generated lots of traction lately. For the next few years, we will see more implementations of a higher level of chiplet designs and heterogeneous integration packaging, whether it is for cost, time-to-market, performance, form factor, or power consumption. In this lecture, the following topics will be covered.
Why Chiplet Design?
Chiplet Design and Heterogeneous Integration Packaging – Chip Partition and Chip Split
Lateral Communication between Chiplets (eg bridges)
Chiplet Design and Heterogeneous Integration Packaging – Multiple System and Heterogeneous Integration
This is an in-person event.
About the Speaker
John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 517 peer-reviewed papers (375 are the principal investigator), 52 issued and pending US patents (30 are the principal inventor), and 23 textbooks (all are the first author), eg Chiplet Design and Heterogeneous Integration Packaging (525 pages, Springer, 2023).
John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry, academy and society meetings and conferences to contribute, learn, and share.
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