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IEEE Lecture : “Large Area Tactile/Electronic Skin” by Dr. Ravinder Dahiya.

Abstract:    The advancements in microelectronics over 50 years have revolutionised our lives through fast computing and communication. Recent advances in the field, pursued through More than Moore technology, are propelled by applications such as robotics, wearable electronics, and healthcare. Often, these applications require electronics to conform to 3D surfaces and this calls for new methods for realising devices on unconventional substrates such as plastics.

The sensitive electronics systems on large areas and possibly stretchable substrates will open new avenues for advances such as robots with conformable electronic skin. This lecture will present various approaches (over different time and dimensional scales) to obtain distributed electronics and sensors on flexible and conformable substrates, especially in context with tactile or electronics skin.

The lecture will begin with recent developments such as using off-the-shelf sensors and electronic components on flexible printed circuit boards to obtain large area tactile skin for robots and wearable systems. This will be followed by various other alternatives being explored (e.g. printing of nanowires, and ultra-thin chips, etc.) today for tactile skin and potential challenges.

The lecture will conclude with a discussion on how the field and associated technologies may evolve in the future with new emerging applications such as internet of things, smart cities and mobile health.

Dr Ravinder Dahiya

Dr. Ravinder Dahiya is Reader and EPSRC Fellow in the School of Engineering at University of Glasgow, UK.  He is Director of Electronics Systems and Design Centre in University of Glasgow and leads the Bendable Electronics and Sensing Technologies (BEST) group, which conducts fundamental research on high-mobility materials based flexible electronics and electronic skin, and their application in robotics, prosthetics and wearable systems.

His multidisciplinary research interests include Flexible and Printable Electronics, Electronic Skin, Robotic Tactile Sensing, and Wearable Electronics. He has published more than 140 research articles, 6 books (5 at various publication stages) and 9 patents (including 7 submitted). He has led many international projects including those funded by European Commission, EPSRC, The Royal Society and The Royal Academy of Engineering.

He is Distinguished Lecturer of IEEE Sensors Council and is on the Editorial Boards of IEEE Transactions on Robotics and IEEE Sensors Journal. He has been Guest Editor of 4 Special Journal Issues. He was General Chair of IEEE PRIME 2015 and is the Technical Program Chair (TPC) for IEEE SENSORS 2017 Conference.

Dr. Dahiya has received in the past the Marie Curie Fellowship and the Japanese Monbusho Fellowship. He was awarded with the University Gold Medal and received 2 best paper awards and 2 second best paper awards (as co-author) at IEEE international conferences. He received the International Association of Advanced Materials (IAAMM) Medal in 2016 and the 2016 Microelectronic Engineering Young Investigator Award.

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