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EMC Chapter Technical Seminar on EMC and Radio Topics.

The IEEE Electromagnetic Compatibility Society, UK and Ireland Chapter  in conjunction with Southern Region Compliance Group invites you to attend the forthcoming technical seminar on EMC and Radio topics.  A full day seminar dealing with regulatory and standardisation aspects of the EMC and Radio Equipment Directives, test methods and validation in the frequency range above 1 GHz. and three-dimensional aspects of printed wiring board design for good electromagnetic compatibility and signal integrity.  It is suitable for all involved in any aspect of EMC or Radio Equipment compliance.

The meeting is open to all and free of charge, but please note the requirement to register in advance (see below).

The technical meeting will be followed by an opportunity to visit the museum free of charge.


10:00 Arrival – tea and coffee will be available

10:30 Welcome by Brian Jones EMC Chapter Chair

10.35 The new EMC Directive and Radio Equipment Directive (RED) – they apply NOW! – Nick Hooper of UL will give us an update on the implementation issues

11:20 Developments in CENELEC product and generic standards for EMCD and RED – John Davies, Chairman of the CENELEC EMC committee TC210

12:00 Lunch break – Food may be purchased in the restaurant

13:00 Antenna calibration and test site validation above 1 GHz – Martin Wiles, ETS-Lindgren

13:40 High-Speed Printed Circuit Boards (PCBs): Signals and the Third Dimension – John Berrie, Electronic Design Technology Partner, Zuken Limited

14:15 Short briefing about the museum, followed by an opportunity to look around

17:00 Site closes

Papers abstracts

The new EMC Directive and Radio Equipment Directive (RED) – They apply NOW!

On 6 July, 77 days will have passed since the date of application of the new EMC Directive 2014/30/EU, and the Radio Equipment Directive 2014/53/EU will be 23 days into its one year transition period from the R&TTE Directive. How have things been going so far?

Nick will describe the current position, including updates on the regulatory situation for each directive including information from the inter-Governmental meetings TCAM and EMC Working Party that oversee the operations of the directives.

Developments in CENELEC product and generic standards for EMCD and RED

The new Radio Equipment Directive defines products within its scope as those that contain transmitters, receivers or both. A domestic appliance with wifi therefore comes within the scope of the Radio Equipment Directive. Will the OJ list for RED include the CENELEC EMC standards currently applying for non-radio products? How will possible conflicts between CENELEC and ETSI standards be dealt with?

John will describe the current position, and the ongoing discussions on this and other hot topics: will emissions/immunity under 150 kHz, power line communications, the CISPR 80/80 rule and regulatory statements, and EMC standards for automotive after sales products ever be resolved? And what new issues are on the horizon?

Antenna calibration and test site validation above 1 GHz

Radiated emissions measurements above 1GHz typically use antennas with higher directivity than below 1GHz. Knowledge of the transmit antenna pattern is needed under CISPR 16-1-4 for the site validation but now criteria and methods of measurement for the receive antenna are being introduced into CISPR 16-1-4, CISPR 16-1-5 and CISPR 16-1-6.

High-Speed Printed Circuit Boards (PCBs): Signals and the Third Dimension

Technology advances mean that simplified models no longer apply even to small PCB objects such as vias that connect signals between conductor layers. To avoid costly design iterations, both modelling and PCB design have evolved.

John will show where the boundaries lie for these features and how 3-D PCB design together with classic coupling formulae can be used to avoid problems in a practicable way.

Information on speakers

Nick Hooper BSc(Eng) CEng MIET SMIEEE

Nick is Chairman of the RED Compliance Association (successor to the R&TTED Compliance Association) an organization that provides the forum for Notified Bodies under those directives to discuss matters associated with the directives with important players in the field such as the European Commission, ECC, ETSI, R&TTE Market Surveillance Authorities and bodies from MRA countries. He is Head of Inspection and Certification at UL (formerly RFI).

John Davies

John is an independent consultant and Chairman of the European electrotechnical standards EMC Committee TC210. He is also Chairman of the British Standards Institution committee GEL/210/11 which deals with worldwide and European product, basic and generic EMC standards.

Martin Wiles B.Sc.(Hons), M.Sc., MBA, MIET

Martin Wiles is Director of Test Solutions, EMEA, at ETS-Lindgren and based in the UK.
He is currently responsible for the European Test Solutions group based in Finland, responsible for the design, installation and integration of EMC and Wireless RF systems. He graduated with a B.Sc. (Hons) in Physics from the University of Bath, England in 1987 and an M.Sc. in Microwave Electronics from the Université de Pierre et Marie Curie, Paris, France in 1988.  In 2015 he completed an MBA with the Open University, UK.

Prior to joining ETS-Lindgren in 1992 he worked on GTEM development at ABB Switzerland and as an RF Engineer for Sopatra in France designing and testing anechoic chambers.
At ETS-Lindgren he has been primarily involved in designing and testing of EMC, Microwave Antenna and Wireless Anechoic Chambers, and providing technical support to the antenna and probe components business. He has also been involved in systems integration since 2003.

Over 20 years he has published and presented numerous papers and workshops on EMC and Wireless topics in Europe, Asia and North America as well as technical articles in trade magazines.
He has been active in EMC standardization for over 20 years.

From 1992-1996 he represented the French National Committee on the European CENELEC TC210 from 1992-1996.  Since 2005 he has been an active member of the UK National Committee for EMC and an expert on IEC-CISPR SC/A working group responsible for the CISPR 16 standard. He is currently convenor of the above 1GHz group within CISPR Sub-Committee A

John Berrie, M.Sc., MIEEE

John Berrie has been much published in the technical press worldwide over many years – mainly on high-speed printed circuit board design and design automation. He was Session Chair of 3D IC and Package Design Issues, Design Automation Conference, San Diego, 2007. John is a Technology Partner with Zuken Technology Centre, Bristol, UK. In his spare time he enjoys live comedy and quizzing; he has appeared on both Weakest Link and Eggheads.
The event is an open meeting, with all welcome. There is no charge for attendance. If you plan to attend you need to register by informing Roy Ediss.

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You will need to provide:

  • Name
  • Company (if applicable)
  • How you heard about the meeting

Travel details can be found at here.

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